Posted by TEAdmin on 2025-03-09 11:08:29 |
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TE Connectivity leverages 3D modeling and simulation tools to design, verify, and optimize high-speed components, ensuring superior signal integrity and product performance. With expertise in component-level simulation, TE provides industry-leading electrical models that help engineers overcome complex design challenges.
Industry-Leading Signal Integrity Expertise
As high-speed designs become more demanding, TE’s signal integrity team offers solutions for system layout, design, and simulation. Their expertise in gigabit-speed interconnects allows them to optimize signal transmission by addressing skin effects, dielectric losses, and noise margins. TE collaborates with leading semiconductor vendors to characterize signals and ensure optimal performance across various high-speed systems.
Advanced Electrical Modeling Techniques
TE provides a range of modeling techniques to support high-speed digital designs:
CAD Mechanical Models & Industry Compliance
TE provides CAD Mechanical Models for precise component integration and ensures compliance with industry standards, including IEEE 802.3, PCI-SIG, HDMI, USB IF, InfiniBand, Fibre Channel, and Open Compute. They also participate in key Multi-Source Agreements (MSAs), such as CFP-MSA, microQSFP MSA, and the 25G Consortium, ensuring compatibility with evolving high-speed technologies.
Custom Signal Integrity Solutions
TE offers a Signal Integrity Model Generator, allowing engineers to create custom PCB stackup models for their designs. With cutting-edge simulation tools, technical expertise, and a vast library of high-speed connector models, TE is a trusted partner in optimizing high-speed digital systems.
For precise, efficient, and high-performance electrical designs, TE’s modeling and simulation solutions provide engineers with the insights needed to stay ahead in competitive markets.